Titanium Anode rau PCB Electroplating

Nyob rau hauv cov tsoos acid tooj liab plating tank rau luam Circuit Court boards, cov tooj liab pob nyob rau hauv lub anode pob tawb yog tas li yaj mus rau hauv Cu2 ntxiv rau ntxiv qhov poob ntawm Cu2 ntxiv deposition nyob rau hauv lub plating tov, ua kom lub concentration ntawm Cu2 ntxiv nyob rau hauv lub plating tov tas li. Tab sis nws txawv ntawm pulse plating, uas nws muaj nws tus yam ntxwv thiab yuav tsum tau. Vim yog qhov tsis txaus ntawm kev siv cov tshuaj soluble anodes, ntau thiab ntau dua DSA Titanium anode rau PCB electroplating yog tam sim no siv los hloov.

1. Insoluble coated titanium anode rau kab rov tav mem tes electroplating

Lub insoluble anodes ntawm kab rov tav pulse plating kab yog ntsia horizontally. Txhua lub anode txuas ncaj qha mus rau qhov hloov ntawm lub zog hluav taws xob nrog lub cable, txhawm rau xyuas kom meej tias tag nrho cov anodes ntawm lub anode muaj tib lub mem tes tam sim no waveform thiab khaws synchronization.

Anodes feem ntau siv insoluble titanium coated anodes:

Substrate: muaj ntshiab titanium Gr2

Txheej: Ruthenium ternary sib xyaw hlau oxide txheej

Puab: mesh, yeeb nkab mesh, thiab lwm yam.

2. Insoluble coated titanium anode rau ntsug mem tes electroplating

Rau ntsug plating tshuab siv insoluble anodes, lub plating da dej yuav tsum tau ntsia raws li tus qauv rau siab nam piv cov khoom. Xws li cov particle agitation txaus thiab zoo filtration. Nws txawv ntawm cov txheej txheem electroplating ntawm tes los ntawm kev hloov cov anode nrog ib qho insoluble-coated titanium anode, ntxiv cov tooj liab regeneration system rau lub voj voog electrolysis, thiab txhim kho qhov sib cais ntawm cathode thiab anode.

Hauv qhov system no, feem ntau muaj teeb meem ntawm kev nce Cu2 ntxiv, uas tuaj yeem zam tau los ntawm kev kho cov ntsiab lus ntawm Cu2 ntxiv los ntawm kev siv lub pob tooj liab yooj yim rov tsim kab. Lub pob tooj liab regeneration kem muaj cov pob tooj liab me me thiab lub diaphragm insoluble titanium anode. Lub peev xwm DC hloov pauv, kom lub siab concentration Cu2 ntxiv los ntawm cov kav dej yog ib nrab tso rau ntawm cov pob tooj liab me me, thiab cov txheej txheem plating nrog qis Cu2 ntxiv cov ntsiab lus raug xa rov qab mus rau electrolytic cell, kom tsis txhob nce ntawm Cu2 ntxiv. hauv electrolyzer.

Cov nyhuv ntawm insoluble txheej titanium anode siv nyob rau hauv no electroplating yog zoo dua li ntawm cov kab rov tav hom. Nyob rau hauv ib tug tej thickness inch ratio, qhov zoo dispersion tus nqi ntawm electroplating feem ntau ncav cuag 90 feem pua ​​- 95 feem pua.

Titanium Anode Rau PCB Electroplating tsim los ntawm Di Noer Technology Co., Ltd. tau raug sim ntau zaus. Cov txheej txheem txheej siv ternary, pentadic lossis ntau lub ntsiab lus hlau sib xyaw oxides. Lub nano txheej morphology muab ib tug loj anode nto yuav tsum tau rau electroplating. Ua ke nrog cov qauv hauv lub network, cov txheej txheem tuaj yeem ua kom muaj kev ruaj ntseg thiab sib xws. Nrog rau kev txhim kho thiab kev txhim kho txuas ntxiv ntawm anode ntau lawm thiab kev siv thev naus laus zis, txheej txheej muaj qhov adhesion muaj zog nrog substrate, tuaj yeem tiv taus tam sim no loj, muaj lub neej ua haujlwm ntev, tsis muaj kuab paug rau cov tshuaj plating, tsis txhob hloov ntau zaus, thiab txuag zog thiab khoom siv. tus nqi.

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